PDF《The 10th Annual China Semiconductor》

The 10th Annual China Semiconductor Technology International Conference March 18-19,

2019 Shanghai, China Plenary Keynote Speakers Dr.

Min Cao Vice President, Path-finding, TSMC Dr. Yaoguo (Gary) Ding Vice President, Technology and Manufacturing Group, Intel Dr. Simon M. Sze Honorary Chair Professor, NCTU Dr. Evangelos Elefthriou Fellow, Neuromorphic Computing, IBM CSTIC

2019 Organizers and Sponsors Attendee Numbers *Symposium I-IX attendee number was Day

1 and Day

2 in total CSTIC Attendee Number

2019 2018 Conference

830 684 Plenary Session

666 549 Symposium I: Device Engineering and Memory Technology

327 287 Symposium II: Lithography and Patterning

415 318 Symposium III: Dry &

Wet Etch and Cleaning

385 206 Symposium IV: Thin Film, Plating and Process Integration

264 172 Symposium V: CMP and Post-Polish Cleaning

246 178 Symposium VI: Metrology, Reliability and Testing

145 110 Symposium VII: Packaging and Assembly

212 175 Symposium VIII:MEMS, Sensors and Emerging Semiconductor Technologies

135 89 Symposium IX: Design and Automation of Circuits and Systems

149 86 Symp II &

III Joint Session

214 239 Symp II, VIII &

IXJoint Session

201 Panel Discussion

214 239 WFD Short Course (Front-end)

99 24 WFD Short Course (Back-end)

116 47 Attendee Industry Distribution ? 70% attendees from industry ? Chip makers like HLMC, HHGrace, Intel, IBM, SMIC,TSMC, UMC, AMT, YMTC, Global Foundries, Samsung, Hynix, JCET, ASE, Huatian and etc. joined the conference ? Design and software companies like Huawei, ZTE, Qualcomm, Lattice, Synopsys, Mentor joined the conference Semiconductor Chip Maker 20% Equipment Company 28% Material/ Consumables Company 14% Academy/University 29% Design Company 4% Software Company 2% Service Company 2% Media 1% Attendee'

s Job Titles ? 27% of our attendees were directors or above, who were the decision makers in companies. CEO, CTO, GM and VPs 13% Directors 14% Managers 18% Fellows/Scientists 5% Process Engineers 21% Professors/ Researchers/Students 28% Chief Editors/ Editors 1% Attendee Country Distribution ? Speakers and attendees were from

17 different countries or districts ? More than

200 speakers and attendees are oversea industry leaders or experts Mainland China 75% Other countries or districts (Singapore, France, UK, Hongkong, Netherlands, Sweden, Finland, India, Israel, Switzerland) 2% Germany 1% Belgium 1% Korea 2% Japan 4% Taiwan China 5% USA 10% Local Attendee City Distribution ? Speakers and attendees were from

34 different cities in China Shanghai 49% Beijing 21% Others (Ningbo, Xuzhou, Wuxi, Fuzhou, Hangzhou, Longyan, Xi'

an,Guangzhou, Hefei, Nantong, Shenyang, Dongguan, Jinan, Haerbin,Weifang, Changzhou, Chengdu, Huizhou,Lanzhou, Qingdao, Huangshan, Weihai, Wulumuqi) 10% Suzhou 3% Dalian 3% Tianjin 3% Huai'

an 3% Wuhan 3% Shenzhen 2% Nanjing 2% Jiangyin 2% >

240 Anticipating Companies DISPLAYLINK UK DK Nanotechnology Inc Dow Chemical Dow DuPont Duke University DuPont East China Normal University Ebara Edwards Electronic Fluorocarbons EpiGaN Etown IP Financial Times China Finisar Corporation Foxconn Fraunhofer ENAS French Institute for Scientific Research(CNRS) Fudan Univeristy Fuzhou University G&

P Technology Georgia Institute of Technology Gigaphoton Inc. Global Research &

Innovative Solutions Co.,Ltd. Globalfoundries Gredmann Group Guangdong University of Technology Gwangju Institute of Science and Technology Hanyang University Harbin insititute of technology Hebei University of Technology HEIDENHAIN LIMITED Hermes Epitek HHGrace HiSilicon Hitachi High-Technologies Corporation HLMC Hon Hai Precision Industry Co Ltd Hua Hong Wuxi Huada Emprean Huangshan University 3M 3MTS ACM Advantest Air Liquide A-kelon (Huizhou) Optronics Ltd AMEC Anji Microelectronics Applied Material ASAKA RIKEN CO., LTD. ASE ASML ASML Brion ASML-Cymer Aufirst Chemicals Avantor Beihang University Beijing Chenjing Electronics Beijing Normal University Beijing Sevenstar Beijing Yandong Microelectronics Beneq BOE Brewer Science BriteIP Brooks Instrument Bruckewell Technology Cabot Microelectronics Canon Inc. Carl Zeiss Changxin Memory Technology D2S Dai Nippon Printing Co., Ltd. Dalian University of Technology Darbond Delta Electronics Department of Electronic Engineering, Feng Chia University DIGITIMES Diodes Disco Huatian Technology(Kunshan) Electronics Co.,Ltd Huawei Huazhong University of Science and Technology IBM IMEC IMECAS Institute of Computing Technology, Chinese Academy of Sciences Intel IRSD Roadmap ITRI JCET Jiangsu Advanced Memory Semiconductor Ltd. Jiangsu Normal University Jiangsun Advanced Memory Technology Johoku Chemical JSR Shanghai Kanomax FMT Inc KANOMAX JAPAN INC KCTech KLA Korea Advanced Institute of Science and Technology KU Leuven Lam Reaearch Lanzhou University of Technology Lattice Semiconductor Co. Leuven Instruments Liverpool John Moores University Macronix Mattson Technology Mentor Graphics Merck Display Materials(Shanghai) Co., Ltd. Middlesex Industries SA Minghsin University of Science and Technology(MUST) MLI MooreElite Moses Lake Industries, Inc. Nanjing University Nanjing University of Posts and Telecommunication Nanjing University of Technology Nanyang Technological University >

240 Anticipating Companies Nata Chemicals National Central University National Chiao Tung University National Taiwan Central University National Taiwan University of Science and Technology National Tsing Hua University Naura NBU NCTU Nikon Ningbo University Nissan Chemical Corporation Novel Crystal Technology NuFlare Technology ONRG Pall Corp. PDF Peking University Pes University Photronics Piotech Plasma-Therm PMS Prismark Partners, LLC Purdue University Qorvo, Inc. QSIL Qualcomm Raintree Technologies S&

J Electronics Samsung Sanechips Science China Press SCREEN Semiconductors Solutions Co.,Ltd. Senju Metal Industry Co., Ltd., Seoul Natioanl University Shandong Shengquan Shanghai IC R&

D Center Co., Ltd. Shanghai Jiaotong University Shanghai Kaixi Tech Shanghai Microelectronics Equipment Shanghai Sunrise Shanghai Tech University Shanghai University Shanghai University of Technology SIEMENS SiEn (Qingdao) Integrated Circuits SIMIT SIMMTECH Singulus Technologies AG SITRI SJ Semiconductor (Jiangyin) Corp. SK HYNIX SKW Associates SMIC SMNC Soochow University South University of Science and Technology SPIL Spirox Technology STATS ChipPAC Sungkyunkwan University Suntific Materials Suzhou IV technology Suzhou Shinhao materials LLC Synopsys Tanjin University of Science &

Technology Technical University of Munich TEL TEL FSI TFME Thermo Fisher Scientific Tokyo Electron Tokyo Institute of Technology Tongfu Microelectronics Toshiba Memory Corp. Towerjazz Tsinghua University TSMC UC Los Angeles UC San Diego ULVAC Unimos University of California, Santa Barbara University of Chinese Academy of Sciences University of Electronic Science and Technology of China University of Massachusetts University of Michigan-Shanghai Jiao Tong University Joint Institute University of Notre Dame University of Twente Uppsala University Versum Materials Viking Global Investors Wolfspeed Wuxi Sky Chip Interconnection Technology Co.,Ltd Xi'

an UniIC Semiconductors Co., Ltd. Xinanna Electronics Technology Yangtze Memory Technologies Co. Zhejiang University Zijin Jia Bo Electronics Zing Semiconductor ZTE 北京元芯碳基集成电路研究院 北京紫光存储科技有限公司 东莞记忆存储科技有限公司 广东惠尔特纳米科技有限公司 国新风险投资管理(深圳)有限公司 今井 基胜, 水户工业(株) 摩西湖(大连)化学工业有限公司 南通至晟微电子技术有限公司 上海亨斯迈聚氨酯特种材料 上海华丽工程技术有限公司 深圳阿科威达 威海金鼎机械制造股份有限公司 无锡湃泰材料科技有限公司 武汉华星光电技术有限公司 西安奕斯伟硅片技术有限公司 芯思想 意发薄膜科技(上海)有限公司 元智大学 浙江舜宇光学 中国电子系统工程第二建设有限公司 紫金矿业集团黄金冶炼有限公司 CSTIC

2020 Chair and Co-chairs Dr. Ru Huang Co-Chair Peking University, China Dr. Hanming Wu Co-Chair Etown, China Dr. Qinghuang Lin Executive Co-Chair ASML, USA Dr. Steve X. Liang Chair JCET, China Dr. Cor Claeys Co-Chair KU Leuven, Belgium CSTIC

2020 Symposia and Chairs Symposium I: Device Engineering and Memory Technology Symposium II: Lithography and Patterning Symposium III: Dry &

Wet Etch and Cleaning Symposium IV: Thin Film, Plating and Process Integration Symposium V: CMP and Post-Polish Cleaning Symposium VI: Metrology, Reliability and Testing Symposium VII: Packaging and Assembly Symposium VI........