PDF《RHC350A》

RHC350A 江苏省无锡市滨湖区马山镇常康路

11 号NO.

11 Chang Kang Road,Mashan Town,Binhu District,Wuxi,Jiangsu,China

214092 Tel:86-510-68578710 Fax: 86-510-68578717 WWW.Relong-Hitech.com RHC350A is a woven fiberglass reinforced, ceramic filled, PTFE- based composite. RHC350A is designed to provide enhanced heat- transfer through Best-In-Class thermal conductivity, while reducing dielectric loss and insertion loss. Lower losses result in higher Amplifier and Antenna Gains / Efficiencies. The increased thermal conductivity of RHC350A provides higher power handling, reduces hot-spots and improves device reliability. This higher heat transfer within the substrate complements designs using coins, heat sinks or thermal via to provide designers additional design margin in managing heat. In designs with limited thermal management options, RHC350A significantly improves heat transfer where the primary thermal path is through the laminate. This results in reduced junction temperatures and extends the life of active components, which is critical for improving power amplifier reliability, extending MTBF and reducing warranty costs. In addition, lower operating temperatures and chip-matching thermal expansion characteristics provide better reliability for component attachment prone to solder fatigue, solder softening and joint failure. RHC350A has excellent Dielectric Constant Stability across a wide temperature range. This helps Power Amplifier and Antenna designers maximize gain and minimize dead bandwidth lost to dielectric constant drift as operating temperature changes. Dielectric constant stability is also critical to phase and impedance sensitive devices such as network transformers utilized for impedance matching networks utilized in power amplifier circuitry or in Wilkinson Power Dividers. RHC350A has low Z-Direction CTE which matches copper. This feature provides unsurpassed plated through hole reliability. RHC350A is a soft substrate that meets military standard requirements for vibration and shock resistance testing. RHC350A enjoys a strong bond to copper, utilizing microwave grade low profile copper. Unlike ceramic hydrocarbons that need to utilize toothy copper to achieve acceptable bond, RHC350A utilizes relatively smooth copper. This results in even lower insertion loss due to skin effect losses of copper that are more obvious at higher RF and microwave frequencies. Features: ? Best in Class Thermal Conductivity( 0.8 W / m K ) ? Dielectric Constant Stability across Wide Temperatures( -

9 pp m / ℃) ? Very Low Loss Tangent provides Higher Amplifier or Antenna Efficiency ? Priced Affordably for Commercial Application ? High Peel Strength for Reliable Copper Adhesion in thermally stressed applications ? Meet Military Standard for Shock and Impact Resistance Test Benefits: ? Heat Dissipation and Management ? Improved Processing and Reliability ? Large Panel Sizes for Multiple Circuit Layout for lowered Processing Costs Typical Applications: ? Power Amplifiers, Filters and Couplers ? Tower Mounted Amplifiers (TMA) and Tower Mounted Boosters (TMB) ? Thermally Cycled Antennas sensitive to dielectric drift ? Microwave Combiner and Power Dividers Thermal Conductivity Ceramic Filled PTFE/Woven Fiberglass Laminate for Microwave Printed Circuits Boards RHC350A Results listed above are typical properties, they are not to be used as specification limits. The above information creates no expressed or implied warranties. The properties of Relong laminates may vary depending on the design and application. Typical Properties: Property Units Value Test Method 1. Electrical Properties Dielectric Constant (may vary by thickness) @