PDF《5A、降压 DC-DC 转换器》

11 C GND pin must be electrically connected to the exposed pad on the printed circuit board for proper operation.

4 TPS54561 ZHCSBY9F CJULY 2013CREVISED FEBRUARY

2017 www.ti.com.cn Copyright ? 2013C2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage VIN C0.3

65 V EN C0.3 8.4 BOOTCSW C0.3

8 FB C0.3

3 COMP C0.3

3 PWRGD C0.3

6 SS/TR C0.3

3 RT/CLK C0.3 3.6 SW, 5-ns Transient C7

65 SW, 10-ns Transient C2

65 SW C0.6

65 Operating junction temperature, TJ C40

150 °C Storage temperature range, Tstg C65

150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply input voltage, VVIN 4.5

60 V Output voltage, VO 0.8 58.8 V Output current, IO

0 5 A Operating junction temperature, TJ -40

150 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where distortion starts to substantially increase. See Power Dissipation Estimate section for more information. 6.4 Thermal Information THERMAL METRIC(1)(2) TPS54561 UNIT DPR (WSON)

10 PINS RθJA Junction-to-ambient thermal resistance (standard board) 35.1 °C/W RθJC(top) Junction-to-case(top) thermal resistance 34.1 °C/W RθJB Junction-to-board thermal resistance 12.3 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-board characterization parameter 12.5 °C/W RθJC(bot) Junction-to-case(bottom) thermal resistance 2.2 °C/W

5 TPS54561 www.ti.com.cn ZHCSBY9F CJULY 2013CREVISED FEBRUARY

2017 Copyright ? 2013C2017, Texas Instruments Incorporated (1) Open Loop current limit measured directly at the SW pin and is independent of the inductor value and slope compensation. 6.5 Electrical Characteristics TJ = C40°C to 150°C, VIN = 4.5 V to

60 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SUPPLY VOLTAGE (VIN PIN) Operating input voltage 4.5

60 V Internal undervoltage lockout threshold Rising 4.1 4.3 4.48 V Internal undervoltage lockout threshold hysteresis

325 mV Shutdown supply current EN =

0 V, 25°C, 4.5 V ≤ VIN ≤

60 V 2.25 4.5 μA Operating: nonswitching supply current FB = 0.9 V, TA = 25°C

152 200 ENABLE AND UVLO (EN PIN) Enable threshold voltage No voltage hysteresis, rising and falling 1.1 1.2 1.3 V Input current Enable threshold +50 mV C4.6 μA Enable threshold C50 mV C0.58 C1.2 -1.8 Hysteresis current C2.2 C3.4 -4.5 μA Enable to COMP active VIN =

12 V, TA = 25°C